Molybdenum Copper alloy
MoCu alloys are made by sintering molybdenum and copper together. This results in a heat sink of lower density, low CTE and excellent thermal conductivity.
Grade
Material | Wt% | Wt% | g/cm3 | Thermal conductivity at 25℃ | Coefficient of thermal |
Mo85Cu15 | Mo | Cu | Density at 20℃ | 160 - 180 | expansion at 20℃ |
Mo80Cu20 | 85± 1 | Balance | 10 | 170 - 190 | 6.8 |
Mo70Cu30 | 80 ± 1 | Balance | 9.9 | 180 - 200 | 7.7 |
Mo60Cu40 | 70 ± 1 | Balance | 9.8 | 210 - 250 | 9.1 |
Mo50Cu50 | 60 ± 1 | Balance | 9.66 | 230 - 270 | 10.3 |
Typical Properties
MoCu | 65/35 | 80/20 | 85/15 | |
Molybdenum | % | 65±3 | 80±2 | 85±2 |
Copper | % | 35±3 | 20±2 | 15±2 |
Density | g/cm3 | 9.73±0.2 | 9.9±0.2 | 10.0±3 |
Hardness | HB2.5/62.5 | 120-150 | 130-160 | 130-160 |
CTE20-100°c | 10-6/K | 8.6 | 6.3 | 6.2 |
CTE20-300°c | 10-6/K | 9.2 | 6.4 | 6.3 |
CTE20-450°c | 10-6/K | 9.6 | 6.6 | 6.5 |
Elastic Modulus | KN/mm² | 210-250 | 220-260 | 220-260 |
Ultimate Tensile Strength | N/mm² | >250 | >300 | >320 |
Yield Strength | N/mm² | >270 | >280 | |
Electrical Conductivity | %IACS | 45 | 35 | 32 |
Electrical Resistiance | Ωmm²/m | 0.038 | 0.042 | 0.042 |
Thermal Conductivity | W/mK | ≥170 | ≥150 | ≥145 |
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